UDV-80J東洋pvc切割保護膜，晶圓切割uv膜廠家，新友維半導
UDV-80J東洋pvc切割保護膜，晶圓切割uv膜廠家，新友維半導
產品價格：￥電詢（人民幣）
  • 規格：0.08*230mm*100m
  • 發貨地：15377723326
  • 品牌：
  • 最小起訂量：1卷
    • 誠信商家
    會員級別：金牌會員
    認證類型：企業認證
    企業證件：通過認證

    商鋪名稱：東莞市新友維膠粘制品有限公司

    聯系人：王桂云（小姐）

    聯系手機：

    固定電話：

    企業郵箱：1779529894@qq.com

    聯系地址：東莞市長安鎮咸西新工業區富寧街9號

    郵編：523861

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    商品詳情

      晶圓切割膠帶 - Pressure Sensitive Series -

      晶圓切割膠帶
      Part Number :
      F - 90
      T - 80
      T - 120
      GE - 200

      A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing. 

      High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form. 

      We Toyo Adtec consider needs of each user and choose appropriate tapes.

      Feature

      ● Various product line
      ● standard type (AD series)
      ● high-performance to difficult-to-adhere workpiece (ＧＤ series)
      ● excellent stability against elapsed deterioration (Ｔ series)
      ● high-performance to laser-dicing (F-90)
      ● Easy pick-up with excellent expandability

      Specification
      Recommended Works Part Number Base
      Film       		Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
      Si
      GaAs
      Other Semiconductor       		F-90MW PO MW 90 10 1 1 PVC-free type
      T-80MW PVC 80 0.8 0.7 Excellent temporal stability
      T-80HW 1.7 1
      T-120HW 120 1.7 1
      Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece

      ＊The above data is just for representing value, and not guaranteed value.
      ＊Static type is lined up.
      ＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
      ＊Separator thickness is not included.

      晶圓切割膠帶 - UV Series -

      晶圓切割膠帶
      Part Number :
      UDV - 80J / UDV - 100J / UHP - 110B
      UHP - 0805MC / UHP - 1005M3
      UHP - 110M3 / UHP - 1025M3
      UHP - 1510M3 / UHP - 1525M3
      USP - 1515M4 / USP - 1515MG
      UDT - 1025MC / UDT - 1325D
      UDT - 1915MC

      A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing. 

      High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on. 

      Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.  Elegrip dicing tapes can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form. 

      We Toyo Adtec consider needs of each user and choose appropriate tapes.


      Feature

      ● Excellent control to back-side chipping and chip fly-off.
      ● Excellent adhesiveness.
      ● Smooth peeling by UV.
      ● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

      Recommended
      Work I       		Si
      GaAs
      Other Semi conductor
      Part Number

      UDV-
      80J

      UDV-
      100J

      UHP-
      110B

      UHP-
      0805MC

      UHP-
      1005M3

      UHP-
      110M3

      基材 PVC PO
      顏色 T MW
      總厚度 (μm)

      80

      100

      110

      85

      105

      110

      黏著力 (μm) 10 5 10
      Adhesive Strength (N/20mm)

      3.8(0.2)

      3.8(0.2)

      2.9(0.2)

      5.0(0.2)

      5.0(0.2)

      7.6(0.2)

      Probe Tack (N/20mm2)

      2.1(0.05)

      2.1(0.05)

      2.7(0.05)

      1.7(0.05)

      2.7(0.05)

      3.9(0.05)

      特性 Easy pickup For less chipping For small size chips
      Recommended
      Work II       		Package
      Part Number

      UHP-1025M3

      UHP-1510M3

      UHP-1525M3

      USP-1515M4

      USP-1515MG

      基材 PO
      顏色 MW
      總厚度 (μm)

      125

      160

      175

      165

      黏著力 (μm)

      25

      10

      25

      		15
      Adhesive Strength (N/20mm)

      12.0(0.2)

      6.5(0.2)

      13.5(0.2)

      14.5(0.2)

      15.0(0.2)

      Probe Tack (N/20mm2)

      5.5(0.05)

      4.2(0.05)

      5.6(0.05)

      6.2(0.05)

      5.9(0.05)

      特性 For encapsulated workpiece
      For less backside burrs
      For less glue scratch-up on the chip side walls
      For less against residue onto a making area
      Recommended
      Work III       		Glass
      Crystal
      Part Number

      UDT-1025MC

      UDT-1325D

      UDT-1915MC

      基材 PET
      顏色 T
      總厚度 (μm)

      125

      155

      203

      黏著力 (μm) 25 15
      Adhesive Strength (N/20mm)

      30.0(0.2)

      20.4(0.2)

      20.3(0.2)

      Probe Tack (N/20mm2)

      7.5(0.05)

      6.7(0.05)

      5.9(0.05)

      特性
      • For less backside cracking
      • For encapsulated workpiece
      • For less backside cracking

      ＊( ) is adhesive strength after UV.
      ＊The above data is just for representing value, and not guaranteed value.
      ＊Static type is lined up.
      ＊Color : MW (Milky White), T (Transparent)
      ＊UV irradiate condition : Light volume=above 150mJ/cm2.
      ＊UV irradiate condition may change with dicing products.
      ＊Separator thickness is not included.
       
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